Korvion
Korvion
Explore our premium custom enterprise servers and storage nodes engineered for parallel processing, AI deep learning architectures, and scalable cloud virtualization.
In the contemporary digital landscape, High-Performance Computing (HPC) and artificial intelligence are no longer distinct branches of computing science. Instead, they have merged into a unified paradigm characterized by heterogeneous scaling, ultra-low latency fabrics, and extreme thermal density. Traditional scientific applications—such as computational fluid dynamics (CFD), seismic profiling, molecular dynamic simulations, and financial risk modeling—now routinely run in parallel with massive machine learning workloads, including deep training and inference of models like the DeepSeek 671B MoE (Mixture of Experts).
Standard off-the-shelf enterprise platforms fail to address the specific performance metrics demanded by this new compute class. Standard systems are bottlenecked by restricted PCIe lanes, limited high-speed storage interfaces, and insufficient power distribution schemes. To mitigate these bottlenecks, organizations are transitioning toward Custom OEM HPC Solutions. This approach enables architectural control, allowing deep custom configurations that match specific data pipeline topologies, maximize GPU-to-CPU bandwidth, and implement targeted network fabrics.
Configure advanced PCIe switches, NVLink networks, and direct-to-host topologies to minimize communication latency and optimize DeepSeek-class distributed training environments.
Overcome the thermal limitations of standard server rooms. Integrate Direct-to-Chip (DLC) cooling plates and custom loops to sustain high-density server configurations up to 100kW per rack.
Utilize our comprehensive hardware vetting systems and quality management processes to guarantee that your custom servers comply with industry regulatory requirements globally.
Founded in 2017, Korvion Technology Co., Ltd. is a professional manufacturer and solution provider specializing in AI GPU servers, high-performance computing (HPC) systems, GPU clusters, and data center infrastructure solutions. Headquartered in Shenzhen, China, our company operates a modern production facility covering 385 square meters. We serve a global client base with reliable, scalable, and customized computing platforms.
With over 9 years of export experience and 15 years of industry expertise, Korvion has established a track record for delivering computing systems tailored to artificial intelligence, machine learning, cloud computing, and enterprise data center applications. Our annual export revenue exceeds USD 18 million, backed by a global supply network of more than 1,250 supply chain partners. We collaborate with tier-1 component suppliers to maintain stable component supply, competitive pricing, and predictable lead times.
Establishment Year
Annual Export Value
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Supply Chain Partners
Quality remains at the center of our custom manufacturing processes. Korvion operates a comprehensive ISO 9001-based quality management system, run by a dedicated team of 56 quality control professionals. Every platform undergoes testing procedures, including incoming material inspection, functional testing, burn-in testing, thermal performance verification, system stability validation, and final shipment inspection. This ensures dependable performance in mission-critical corporate installations.
Our commitment to innovation drives regular upgrades. Our R&D department consists of 128 experienced engineers specializing in server architecture, thermal design, AI computing optimization, and customized hardware integration. Last year alone, Korvion introduced 86 new products and solution upgrades, helping customers maintain technology cycles in the AI infrastructure market.
To assist system architects and engineering leads, Korvion designs solutions aligned with the technical roadmap of the computing industry. Modern computing infrastructure is moving away from generic server chassis toward integrated physical nodes optimized for workload profiles.
Implementing PCIe Gen 5.0 architectures across all core nodes allows double the raw bandwidth of previous generations. This supports 400G and 800G Network Interface Cards (NICs), preventing communication bottlenecks in GPU clusters scaling beyond 512 nodes.
Implementing custom cold-plate liquid cooling modules directly on high-TDP processor units, coupled with high-flow exhaust systems, allows thermal control within a 2U or 4U rack profile, improving overall power usage effectiveness (PUE) at the facility level.
Leveraging high-speed NVMe-oF (NVMe over Fabrics) storage nodes with PCIe Gen 4/5 Tri-Mode controllers. This configuration supports concurrent data pipelines, ensuring that storage performance scales alongside raw compute capacity.
HPC configurations must be tailored to their specific operating environments. Korvion's custom OEM configurations are currently utilized across several key industrial sectors:
Processing genomic sequencing workloads requires high-throughput memory channels and low-latency storage. Korvion systems accelerate sequencing algorithms, reducing diagnostic pipeline processing times.
Subsurface modeling in energy exploration requires processing petabytes of seismic data. Our custom high-density nodes allow engineers to compute 3D imaging metrics with minimal data queuing.
Training and serving modern LLMs requires deep integration between high-bandwidth memory (HBM) and node interfaces. Korvion custom server builds provide the high throughput necessary for real-time inference clusters.
Our OEM and ODM services are fully flexible. We provide chassis customization, specialized mechanical branding, custom backplane design, internal PCIe layout optimization, direct-to-chip liquid cooling block mounting, and power distribution options (AC/DC and multi-phase redundancy configs). This ensures compliance with various data center setups.
Every built server platform undergoes a multi-phase testing procedure. This includes incoming component inspection, system-level operational verification, extended thermal validation at 45°C, high-stress CPU and memory burn-in tests, and full PCIe channel trace evaluations. This process reduces infant mortality rates of components prior to shipping.
We offer copper and optical interconnect solutions, including 10G/40G QSFP+ direct-attach copper cables, 100G/200G InfiniBand configurations, and ultra-high-speed network interface cards. This provides the bandwidth necessary for low-latency node-to-node configurations in high-density installations.
With 9+ years of export experience and active supply chain partnerships in multiple regions, Korvion handles international customs clearance, export declarations, and freight forwarding processes. Our packaging is designed to protect delicate multi-processor configurations during transport.
Examine our custom networking interconnects, Direct-Attach-Cables, and modular rack architectures optimized to sustain dense data flows across cluster clusters.
